Colloidal Silica Polishing Suspension - Low Crystallizing

Formulated for the same final polishing step as these brand products:

•
Buehler — MasterMet / MasterMet 2

•
Struers — OP-S / OP-U

•
Allied High Tech — colloidal silica suspension

This low-crystallizing formulation is especially comparable to the non-crystallizing options (MasterMet 2, OP-U). Runs on Buehler, Struers, LECO, Allied, and PACE systems with no change to your process. It is a comparable product for the same step — not a branded or drop-in item.

Same grading, typically 20–40% less.

Request a free sample and test it on your own bench.

Colloidal Silica Polishing Suspension

What This Product Is

Colloidal silica is a water-based suspension of sub-micron amorphous silica particles (nominally around 0.04 µm) used for the final polishing step in metallographic and materials preparation. It works chemo-mechanically: fine silica particles provide gentle mechanical abrasion while the mildly alkaline carrier adds a chemical polishing action. Together they remove the last of the fine deformation left by diamond polishing and produce a bright, deformation-free surface.

This is a low-crystallizing formulation. Standard colloidal silica dries into hard silica crystals that scratch specimens and clog cloths and equipment. A low-crystallizing suspension resists that drying, which reduces scratching, makes cleanup easier, and extends the life of platens and cloths.

Intended Use in Metallography