An epoxy (glass-filled) hot compression mounting compound for the same mounting step as these brand products:
•
Buehler — EpoMet (F/G)
•
Struers — DuroFast
•
Allied High Tech — epoxy mounting compound
Runs in Buehler, Struers, LECO, Allied, and PACE mounting presses with no change to your process. It is a comparable product for the same step — not a branded or drop-in item.
Same grading, typically 20–40% less.
Request a free sample and test it on your own press.
Epoxy Compression Mounting Compound
What This Product Is
An epoxy (glass-filled) hot compression mounting compound. Cured under heat and pressure, this epoxy compound is harder and shrinks less than phenolic, giving excellent edge retention and a tight specimen-to-mount fit — the choice when the edge of the specimen must stay flat and in focus.
Intended Use in Metallography
Used at the mounting step when edge retention and dimensional stability matter. Selected when:
- Examining features at or near the specimen edge
- Coatings, plating, or surface layers must stay flat and in focus
- Low shrinkage and a tight mount fit are required
Typical Applications
- Coated, plated, or surface-treated specimens
- Case-hardened and edge-critical samples
- Demanding failure-analysis and QC mounts
When This Product Is NOT Ideal
- For routine work where economical phenolic is sufficient
- When an electrically conductive mount is required (use the graphite-filled compound)
Manufacturer’s product information (betadiamond.com, opens in a new tab)