Diamond Plated Wafering Blade

Made for the same precision sectioning cuts as these brand products:

•
Buehler — IsoMet diamond wafering blades

•
Struers — diamond cut-off wheels

•
Allied High Tech — diamond wafering blades

Sized to fit the major low-speed and precision saws with no change to your setup. It is a comparable product for the same cut — not a branded or drop-in item.

Same grading, typically 20–40% less.

Request a free sample and test it on your own saw.

Diamond Plated Wafering Blade

What This Product Is

A nickel-bonded, diamond-plated wafering blade. The diamond is plated onto the blade in a single layer, which allows very thin blades and an aggressive, precise cut — one of the toughest, most precise blade types for delicate and thin-kerf sectioning where minimizing material loss matters.

Intended Use in Metallography and Petrography

Used for precision sectioning where a thin kerf, minimal material loss, and clean cuts on delicate or difficult specimens are the priority. Selected when:

• Cutting delicate specimens or thin sections

• Minimizing kerf loss is important

• A tough, precise plated edge is wanted

Typical Applications

• Delicate and thin specimens

• Electronic materials and small components

• Metallographic and petrographic samples requiring minimal material loss

When This Product Is NOT Ideal

• For very hard, high-volume cutting better served by a thicker sintered blade